In the pursuit of miniaturized and high-performance electronic devices, thermal pads serve as silent guardians. They fill gaps, establish efficient heat conduction channels, and shoulder multiple responsibilities including insulation, shock …
Want to mix aluminum nitride (AlN) filler, a high-thermal-conductivity ceramic powder, into epoxy resin to make thermally conductive materials? Simply blending them in often yields disappointing results. The crucial step is: surface …
Today, with the continuous increase in the power density of electronic devices, heat dissipation has become one of the key bottlenecks restricting technological development. Traditional thermal interface materials are gradually unable to …